Suwon, South Korea

Young-Min Ban

This inventor holds 1 USPTO granted patent. Top assignee: Samsung Electro-Mechanics Co., Ltd.. Active years: 2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Young-Min Ban. Retrieved from https://idiyas.com/inventor/young-min-ban-wkr600ux

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2015

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1 patent (USPTO):Explore Patents

Title: Young-Min Ban and EMI Noise Reduction Package Board.

Introduction

Young-Min Ban is an inventor associated with Suwon, South Korea, and Samsung Electro-Mechanics Co., Ltd. His listed patent concerns reducing electromagnetic interference (EMI) noise in a package board.

Latest Patents

Ban’s provided patent, “Electromagnetic Interference Noise Reduction Package Board,” describes a board designed to inhibit EMI from radiating through its side. The design divides the board into a signal-layer area and an adjacent area containing repeated unit structures. Each unit structure uses opposing conductive plates on the board’s top and bottom layers, connected by a via. The supplied information lists 1 patent for Ban.

Career Highlights

The available information identifies Ban’s work in connection with Samsung Electro-Mechanics Co., Ltd. His patent focuses on a package-board structure that uses conductive plates and vias to help contain EMI noise.

Collaborations

Han Bit Kim and Dae-Hyun Park are identified as Ban’s coworkers. The provided information does not specify their roles in the patent or whether they collaborated with him on this invention.

Conclusion

Young-Min Ban’s listed invention applies a repeated conductive-plate-and-via structure to reduce EMI radiation from a package board.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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