Young-kun Jee is a prominent inventor based in Cheonan-si, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of 6 patents. His work is instrumental in advancing technology in this critical area.

Latest Patents

Among his latest innovations is a semiconductor package that features a first package substrate and a first semiconductor chip mounted on it. This package includes a plurality of first chip connection units that connect the first package substrate to the first semiconductor chip. Additionally, it incorporates an interposer on the first semiconductor chip, which has a width greater than that of the first semiconductor chip in a direction parallel to the upper surface of the first package substrate. The upper filling layer consists of a center portion located between the first semiconductor chip and the interposer, along with an outer portion that surrounds the center portion and has a thickness greater than that of the center portion in a direction perpendicular to the upper surface of the first package substrate.

Career Highlights

Young-kun Jee is currently employed at Samsung Electronics Co., Ltd., where he continues to innovate and develop new technologies in semiconductor packaging. His expertise and dedication have made him a valuable asset to the company.

Collaborations

He has collaborated with notable coworkers such as Tae-Hong Min and Un-Byoung Kang, contributing to various projects that enhance the capabilities of semiconductor technology.

Conclusion

Young-kun Jee's contributions to semiconductor packaging demonstrate his commitment to innovation and excellence in technology. His patents reflect a deep understanding of the complexities involved in semiconductor design and manufacturing.

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