Suwon, South Korea

Youn Chul Kim

This inventor holds 2 USPTO granted patents. Top assignee: Ehwa Diamond Ind. Co., Ltd.. Active years: 2002-2003.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Youn Chul Kim. Retrieved from https://idiyas.com/inventor/youn-chul-kim-esh03lsm

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 50.0

Average Co-Inventor Count = 2.0

ph-index = 2

Forward Citations = 20(Granted Patents)


Company Filing History:


Years Active: 2002-2003

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2 patents (USPTO):Explore Patents

Title: Youn Chul Kim: Innovator in Diamond Saw Blade Technology

Introduction

Youn Chul Kim is a prominent inventor based in Suwon-si, South Korea. He has made significant contributions to the field of cutting tools, particularly in the development of diamond saw blades. With a total of two patents to his name, Kim's work has had a notable impact on the industry.

Latest Patents

Among his latest innovations are the "Diamond saw blade equipped with undercut preventing tip" and the "Segment tip for saw blade." These patents showcase his commitment to enhancing the performance and safety of cutting tools.

Career Highlights

Youn Chul Kim is currently employed at Ehwa Diamond Industries Co., Ltd., a leading company in the diamond tool manufacturing sector. His role at the company allows him to apply his expertise in developing advanced cutting solutions.

Collaborations

Kim collaborates with fellow inventor Chang Hyun Lee, contributing to the innovative environment at Ehwa Diamond Industries Co., Ltd. Their partnership fosters creativity and drives the development of new technologies in the diamond tool industry.

Conclusion

Youn Chul Kim's contributions to diamond saw blade technology exemplify his dedication to innovation and excellence. His patents reflect a deep understanding of the industry's needs and a commitment to advancing cutting tool technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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