This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignee: General Electric Company. Active years: 2022-2023.
Company Filing History:
Years Active: 2022-2023
Title: Youichi Nishihara: Innovator in Electronics Packaging
Introduction
Youichi Nishihara is a notable inventor based in Nagano, Japan. He has made significant contributions to the field of electronics packaging, holding a total of 2 patents. His work focuses on innovative methods for enhancing the functionality and efficiency of electronic components.
Latest Patents
Nishihara's latest patents include a groundbreaking invention titled "Mechanical punched via formation in electronics package and electronics package formed thereby." This invention describes an electronics package that features an electrically insulating substrate with a first and second surface. An adhesive layer is positioned on the first surface, and an electrical component is coupled to this adhesive layer. The component has contact pads on its top surface. Vias are formed through the substrate and adhesive layer at locations corresponding to the contact pads using a mechanical punching operation. Each via has a wall extending from the second surface of the substrate to a respective contact pad. Notably, the substrate includes a protrusion that extends outwardly from the first surface, covering part of the adhesive layer and forming part of the via wall.
Career Highlights
Youichi Nishihara is currently employed at General Electric Company, where he continues to innovate in the field of electronics. His work has been instrumental in advancing technologies that improve electronic packaging solutions.
Collaborations
Nishihara collaborates with various professionals in his field, including his coworker Christopher James Kapusta. Their combined expertise contributes to the development of cutting-edge technologies in electronics.
Conclusion
Youichi Nishihara is a prominent figure in the realm of electronics packaging, with a focus on innovative solutions that enhance electronic components. His contributions through patents and collaborations continue to shape the future of technology in this field.