Company Filing History:
Years Active: 1994-1997
Title: Youichi Matsuno: Innovator in Semiconductor Technology
Introduction
Youichi Matsuno is a prominent inventor based in Koganei, Japan. He has made significant contributions to the field of semiconductor technology, particularly in the development of innovative DRAM chip arrangements. With a total of 2 patents, Matsuno's work has had a considerable impact on the efficiency and functionality of multi-chip semiconductor packages.
Latest Patents
Matsuno's latest patents include a "Sealed Stacked Arrangement of Semiconductor Devices" and a "Multi-Chip Semiconductor Package." In the first patent, a pair of DRAM chips are mounted opposedly to each other with wiring means such as lead frames placed in between. These lead frames are integral with external terminals, allowing for effective connection through conventional wire bonding methods. The design enables multiple pairs of DRAM chips to be stacked, with corresponding leads connected to form a laminate. This arrangement allows for selective activation of the DRAM chips based on predetermined chip selection signals. The second patent describes a similar configuration, emphasizing the stacking of DRAM chips and the integration of partial DRAM chips to create a single DRAM package.
Career Highlights
Youichi Matsuno is associated with Hitachi, Ltd., a leading company in the technology sector. His work at Hitachi has allowed him to explore and innovate within the semiconductor industry, contributing to advancements that enhance the performance of electronic devices.
Collaborations
Matsuno has collaborated with notable coworkers such as Satoshi Oguchi and Masamichi Ishihara. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies in semiconductor design.
Conclusion
Youichi Matsuno's contributions to semiconductor technology through his patents and work at Hitachi, Ltd. highlight his role as an influential inventor in the field. His innovative approaches to DRAM chip arrangements continue to shape the future of electronic devices.