Company Filing History:
Years Active: 2009-2010
Title: Innovations by Youichi Kodama: A Trailblazer in Adhesive Technology
Introduction
Youichi Kodama, an inventive mind residing in Sodegaura, Japan, has made significant contributions to the field of adhesive technology. With two patents to his name, Kodama has focused on enhancing the performance and applicability of adhesive materials, particularly in semiconductor packaging.
Latest Patents
Kodama's latest innovations include two key patents:
1. **Film Adhesive and Semiconductor Package Using the Same**
This patent presents a film adhesive that incorporates an adhesive layer containing a thermoplastic polyimide with a glass transition temperature not exceeding 100°C. The adhesive is designed to offer excellent low-temperature adhesive properties and covering capabilities, functioning as a die bonding adhesive film suitable for semiconductor packages. Additionally, it serves a dual role, acting as both a die bonding adhesive film and a dicing tape.
2. **Adhesive Resin Composition and Adhesive Agent in Film Form, and Semiconductor Device Using the Same**
This invention aims to provide an adhesive resin composition that ensures strong adhesion at low temperatures while maintaining heat resistance. The adhesive is formulated in film form, making it ideal for application in semiconductor devices, further pushing the boundaries of adhesive technology in the electronics sector.
Career Highlights
Kodama is associated with Mitsui Chemicals, Inc., where he utilizes his expertise in adhesive materials and their practical applications in the semiconductor industry. His innovative approach has not only advanced manufacturing processes but has also contributed to improving the reliability and performance of electronic devices.
Collaborations
Throughout his career, Youichi Kodama has collaborated with notable colleagues, including Seiji Itami and Kuniaki Sato. These partnerships have facilitated knowledge sharing and enhanced the innovation process, resulting in cutting-edge developments in adhesive technologies.
Conclusion
Youichi Kodama stands as a remarkable inventor whose contributions to adhesive technology resonate within the semiconductor industry. His patents reflect a commitment to advancing material science and improving the effectiveness of adhesive applications. As technology evolves, his work continues to inspire future innovations in this critical field.