The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 2010
Filed:
Nov. 14, 2005
Youichi Kodama, Sodegaura, JP;
Seiji Itami, Mobara, JP;
Kuniaki Sato, Sodegaura, JP;
Syuji Tahara, Sodegaura, JP;
Youichi Kodama, Sodegaura, JP;
Seiji Itami, Mobara, JP;
Kuniaki Sato, Sodegaura, JP;
Syuji Tahara, Sodegaura, JP;
Mitsui Chemicals, Inc., Minato-Ku, Tokyo, JP;
Abstract
A film adhesive having an adhesive layer (C) mainly containing a thermoplastic polyimide having a glass transition temperature of not more than 100° C. and an adhesive layer (D) having a storage shear modulus of not more than 10Pa at 50° C. Furthermore, the film adhesive further comprises a base material (A) and an adhesive layer (B). The film adhesive can exhibit excellent low-temperature adhesive property and covering capability functioning as a die bonding adhesive film which can be used in a semiconductor package. In addition, the film adhesive can exhibit excellent low-temperature adhesive property and covering capability which functions both as a die bonding adhesive film and as a dicing tape.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile