Company Filing History:
Years Active: 1998
Title: Youhei Watabe: Innovator in Metal Powder Technology
Introduction: Youhei Watabe is a notable inventor based in Miyagi, Japan, recognized for his contributions to the field of metallization through innovative metal powder compositions. With a single patent to his name, Watabe's work plays a crucial role in enhancing the efficiencies of metallized substrates used in various applications.
Latest Patents: Watabe's patent, titled "Metal powder composition for metallization and a metallized substrate," focuses on a unique metal powder composition. His invention is primarily intended for the creation of a metallized film derived from a paste containing copper (Cu) and titanium (Ti) powder. The composition comprises approximately 95 to 99.5% copper and 0.5 to less than 5% titanium by weight. The patented paste is applied onto a substrate and subsequently fired to form a highly efficient metallized substrate, indicating a significant advancement in the field of metal processing.
Career Highlights: Watabe is affiliated with Tokin Corporation, where he applies his expertise in material science and metallization technology. His work has led to advancements that are critical for industries that rely on efficient metallization processes, such as electronics and manufacturing.
Collaborations: Throughout his career, Watabe has collaborated with esteemed colleagues, including Shinichi Iwata and Tomeji Ohno. Their collective efforts have contributed to a deeper understanding of metallization techniques and helped drive innovation within their field.
Conclusion: Youhei Watabe stands as a dedicated inventor within the metallization landscape. His patented metal powder composition not only underscores his ingenuity but also serves as a foundation for future innovations in substrate technologies. With continued collaboration and research, Watabe's contributions are likely to influence advancements in metallization and related fields.