The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 1998

Filed:

Sep. 12, 1996
Applicant:
Inventors:

Youhei Watabe, Miyagi, JP;

Shinichi Iwata, Miyagi, JP;

Tomeji Ohno, Miyagi, JP;

Assignee:

Tokin Corporation, Miyagi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F / ;
U.S. Cl.
CPC ...
75255 ; 420492 ;
Abstract

A metal powder composition for metallization is for use in forming a metallized film from a paste comprising Cu and Ti powder and consists essentially of about 95 to 99.5% Cu and 0.5 to less than 5% Ti by weight. The above-mentioned paste is then applied onto a substrate and then fired to provide a metallized substrate.


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