Tainan, Taiwan

You-Wei Lin

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Taiwan Aerogel Technology Material Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: You-Wei Lin. Retrieved from https://idiyas.com/inventor/you-wei-lin-v2lclsjv

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: You-Wei Lin and Aerogel Thermal Insulation

Introduction

You-Wei Lin is an inventor based in Tainan, Taiwan. His work includes a patented method for producing aerogel thermal insulation sheets using a central injection approach.

Latest Patents

Lin’s patent, “Production of Aerogel Thermal Insulation Sheet by Central Injection Approach,” describes a process for making aerogel-fabric composite insulation sheets. It combines hydrolysis and mixing, condensation and dispersion, central injection, drying, and solvent recycling. The aerogel solution is rapidly dispersed and injected from the inside out into a roll-shaped or multilayer fabric substrate. After the substrate is saturated and gelation occurs, the material is dried, with solvent recycling incorporated into the process. Optional hot-pressing and automated cutting can produce flat, multilayer insulation sheets. Lin has 1 patent.

Career Highlights

Lin is associated with Taiwan Aerogel Technology Material Co., Ltd. His patented process focuses on integrating aerogel with fabric substrates and streamlining production through injection, drying, and solvent-recycling techniques.

Collaborations

Lin’s listed coworkers include Jean-Hong Chen and Cheng-shu Chiang.

Conclusion

You-Wei Lin’s patent presents a manufacturing approach for producing multilayer aerogel thermal insulation sheets, combining material processing with solvent recovery and optional finishing steps.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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