You-Wei Lin

Title: You-Wei Lin: Innovator in Semiconductor Packaging

Introduction

You-Wei Lin is a prominent inventor based in Hsinchu Hsien, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 7 patents. His innovative designs and methods have advanced the technology used in electronic devices.

Latest Patents

One of his latest patents is a semiconductor package that includes a carrier, a package module, and a second package body. The package module is disposed on the carrier and consists of a first substrate, a first electronic element, a first conductive wire, and a first package body. The first substrate has a first electrical surface facing the carrier and a second electrical surface opposite to it. The first electronic element is placed on the first electrical surface, while the first conductive wire connects the electronic element with the first electrical surface of the first substrate. The first package body encapsulates the first electrical surface, the first electronic element, and the first solder wire. The second package body encapsulates the package module and a portion of the carrier.

Another notable patent is a method for forming a semiconductor package. This package includes a die attach pad and a plurality of lead terminals arranged around the die attach pad. A semiconductor die is mounted on the die attach pad, and a molding compound encapsulates the lead terminals, the semiconductor die, and the die attach pad. A step cut is sawn into the molding compound along the perimeter of the bottom surface of the semiconductor package. This step cut penetrates through the entire thickness of each lead terminal, ensuring that each terminal has at least an exposed outer end at the step cut.

Career Highlights

You-Wei Lin has worked with notable companies such as MediaTek Corporation and Raynergy Tek Incorporation. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in semiconductor technology.

Collaborations

Throughout his career, You-Wei Lin has collaborated with talented individuals, including Chih-Feng Fan and Chain-Shu Hsu. These partnerships have fostered innovation and creativity in their projects.

Conclusion

You-Wei Lin's contributions to semiconductor packaging have made a significant impact on the industry. His innovative patents and collaborations with esteemed colleagues highlight his dedication to advancing technology. His work continues to influence the development of electronic devices worldwide.