The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2020
Filed:
Jul. 20, 2018
Applicant:
Mstar Semiconductor, Inc., Hsinchu Hsien, TW;
Inventor:
You-Wei Lin, Hsinchu Hsien, TW;
Assignee:
MEDIATEK INC., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/16 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 23/16 (2013.01); H01L 23/3114 (2013.01); H01L 23/3121 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49171 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/15174 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/3511 (2013.01);
Abstract
A chip package structure includes a substrate, a die, a plurality of warpage retainers, and an encapsulant. The substrate has a surface, on which the die is provided. The warpage retainers are provided at at least one corner of the substrate. The encapsulant covers the surface of the substrate, the die and the warpage retainers.