Cheonan-si, South Korea

You Jin Oh


Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 8(Granted Patents)


Company Filing History:


Years Active: 2018

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1 patent (USPTO):Explore Patents

Title: You Jin Oh - Innovator in Semiconductor Technology

Introduction

You Jin Oh is a prominent inventor based in Cheonan-si, South Korea. He has made significant contributions to the field of semiconductor technology, particularly in the area of packaging methods. His innovative approach has led to the development of a unique patent that enhances the efficiency and functionality of semiconductor devices.

Latest Patents

You Jin Oh holds a patent for a "Wafer level fan-out package and method for manufacturing the same." This patent describes a method for manufacturing a wafer level fan-out package that includes attaching a semiconductor chip on a partial area of an IO pattern formed on one surface of a wafer. The process involves forming a first passivation layer on the surfaces of the semiconductor chip and the wafer, creating a redistribution layer (RDL) that is electrically conducted with the IO pattern and the semiconductor chip, and forming a second passivation layer on the top surface of the first passivation layer and a partial surface of the RDL.

Career Highlights

You Jin Oh is currently employed at STS Semiconductor & Telecommunications Co., Ltd. His work at this company has allowed him to focus on advancing semiconductor packaging technologies. His expertise and innovative mindset have positioned him as a key player in the industry.

Collaborations

You Jin Oh has collaborated with notable colleagues, including Eun Dong Kim and Jong Won Lee. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies in semiconductor manufacturing.

Conclusion

You Jin Oh's contributions to semiconductor technology through his innovative patent and collaborative efforts highlight his importance in the field. His work continues to influence advancements in semiconductor packaging methods, showcasing the impact of dedicated inventors in technology.

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