Kagawa, Japan

Yoshizou Nakamura

This inventor holds 1 USPTO granted patent. Top assignee: Tokai Company. Active years: 2003.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yoshizou Nakamura. Retrieved from https://idiyas.com/inventor/yoshizou-nakamura

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 1.0

ph-index = 1

Forward Citations = 12(Granted Patents)


Company Filing History:


Years Active: 2003

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1 patent (USPTO):Explore Patents

Title: Innovations by Yoshizou Nakamura in Fabric Processing Automation

Introduction

Yoshizou Nakamura is a notable inventor based in Kagawa, Japan. He has made significant contributions to the field of fabric processing, particularly in automating the cleaning of rectangular sheets of fabric. His innovative approach addresses a critical step in the laundering process that has traditionally required manual labor.

Latest Patents

Nakamura holds a patent for a "Method and apparatus for spreading a rectangular sheet of fabric." This invention focuses on automating the spreading step, which is essential for the efficient cleaning of dirty rectangular sheets of fabric. The patent outlines a method that involves gripping the fabric at specific corners and suspending it in a way that allows for straightening and spreading, thereby streamlining the entire cleaning process.

Career Highlights

Yoshizou Nakamura is associated with Tokai Company, where he has applied his expertise in fabric processing technologies. His work has led to advancements that not only improve efficiency but also enhance the quality of fabric care.

Collaborations

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Conclusion

Yoshizou Nakamura's innovative methods for automating fabric processing represent a significant advancement in the industry. His contributions are paving the way for more efficient and effective cleaning solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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