Chita, Japan

Yoshiyuki Yamauchi

This inventor holds 25 USPTO granted patents and 2 published patent applications, primarily in Heat Exchanger Technology. Top assignees: Nippondenso Co., Ltd., Denso Corporation. Active years: 1986-2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yoshiyuki Yamauchi. Retrieved from https://idiyas.com/inventor/yoshiyuki-yamauchi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 25 

% Patents Active = 92.0

Average Co-Inventor Count = 3.5

ph-index = 13

Forward Citations = 395(Granted Patents)


Location History:

  • Aichi, JP (1986 - 1988)
  • Agui, JP (1992)
  • Chita, JP (1989 - 2001)
  • Aichi-gun, JP (2001)
  • Chita-gun, JP (1996 - 2006)
  • Aichi-ken, JP (2015)

Company Filing History:


Years Active: 1986-2015

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Areas of Expertise:
Heat Exchanger
Semiconductor Module
Cooling Mechanism
Evaporator
Refrigerant Cycle
Multi-layer Type
Plate Type
Thermal Management
Fluid Passage
Accumulator Module
Decompression Device
Laminate-type
25 patents (USPTO):Explore Patents

Title: Innovator Spotlight: Yoshiyuki Yamauchi

Introduction

Yoshiyuki Yamauchi, an esteemed inventor from Chita-gun, Japan, has made remarkable contributions to the field of semiconductor technology with a total of 25 patents to his name. His innovative work focuses on enhancing the efficiency and functionality of semiconductor devices, which are essential components in modern electronics.

Latest Patents

One of his latest patents involves a semiconductor module designed to improve heat dissipation. This semiconductor module includes an intermediate plate with high heat conductivity, power semiconductor elements on its surfaces, and heat sinks that securely hold the semiconductor elements in place while being sealed with mold resin. The design ensures that the surfaces of the heat sinks are exposed from the mold part, enhancing thermal management.

Another noteworthy patent is for a semiconductor module featuring a cooling mechanism and production method. This design integrates a resin mold that contains a coolant path to cool an embedded semiconductor chip effectively. The mold is equipped with heat spreaders and embedded electric terminals, where each heat spreader has a welded fin heat sink. This innovative approach minimizes electrical leakage, optimally balancing performance and safety in semiconductor applications.

Career Highlights

Yamauchi has enjoyed a distinguished career, having worked with reputable companies such as Nippondenso Co., Ltd. and Denso Corporation. His experiences in these firms have not only honed his technical skills but also provided him with a platform to innovate and lead groundbreaking projects.

Collaborations

Throughout his career, Yamauchi has collaborated with several talented individuals in the industry, including Masahiro Shimoya and Toshio Ohara. These collaborations have fostered an environment of creativity and knowledge sharing, which have been integral to his success in obtaining numerous patents.

Conclusion

Yoshiyuki Yamauchi stands out as a significant figure in the semiconductor industry, contributing to innovations that enhance electronic devices' performance and reliability. His ongoing work will likely continue shaping the future of semiconductor technology, reflecting his commitment to advancing this critical field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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