Wakayama, Japan

Yoshio Ueyama

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Panasonic Intellectual Property Management Co., Ltd.. Active years: 2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yoshio Ueyama. Retrieved from https://idiyas.com/inventor/yoshio-ueyama

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

 

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: The Innovations of Yoshio Ueyama

Introduction

Yoshio Ueyama is a notable inventor based in Wakayama, Japan. He has made significant contributions to the field of adhesive technology. His work focuses on developing innovative solutions that enhance manufacturing processes.

Latest Patents

Ueyama holds a patent for an "Adhesive for heat press molding, wooden board, and manufacturing methods thereof." This adhesive is a reaction product obtained through heat treatment of a mixture containing a polycarboxylic acid and a saccharide. His invention aims to improve the efficiency and effectiveness of heat press molding applications.

Career Highlights

Yoshio Ueyama is associated with Panasonic Intellectual Property Management Co., Ltd. His role in the company has allowed him to explore and develop new adhesive technologies. Ueyama's expertise in this area has led to advancements that benefit various manufacturing sectors.

Collaborations

Ueyama has worked alongside Shigeki Naito, contributing to the development of innovative adhesive solutions. Their collaboration has fostered a creative environment that encourages the exploration of new ideas and technologies.

Conclusion

Yoshio Ueyama's contributions to adhesive technology exemplify the spirit of innovation. His patent and work at Panasonic Intellectual Property Management Co., Ltd. highlight the importance of research and development in advancing manufacturing processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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