Yokohama, Japan

Yoshio Oozeki

USPTO Granted Patents = 9 

Average Co-Inventor Count = 4.8

ph-index = 4

Forward Citations = 22(Granted Patents)


Location History:

  • Ebina, JP (2005 - 2009)
  • Yokohama, JP (2009 - 2013)

Company Filing History:


Years Active: 2005-2013

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9 patents (USPTO):

Title: Innovations of Yoshio Oozeki

Introduction

Yoshio Oozeki is a notable inventor based in Yokohama, Japan. He has made significant contributions to the field of technology, holding a total of nine patents. His work primarily focuses on advancements in adhesive technologies and flexible printed circuits.

Latest Patents

One of his latest patents is a Pipe Module, which involves a temporary part fixed to a base using an adhesive layer mixed with fillers at a predetermined density. When heated, the adhesive layer thermally contracts, releasing stress, while the fillers expand, facilitating disassembly. Another significant patent is the Connection Structure of Flexible Printed Circuits and Optical Pickup Device, which details a connection structure comprising first and second flexible printed circuits. These circuits include a base formed of resin and wiring patterns arranged side by side. The connection portions of the circuits are designed to be connected through soldering, enhancing the efficiency of electronic devices.

Career Highlights

Yoshio Oozeki has worked with prominent companies such as Hitachi Media Electronics Co., Ltd. and Hitachi Plant Technologies, Ltd. His experience in these organizations has allowed him to develop innovative solutions that address complex engineering challenges.

Collaborations

Throughout his career, Oozeki has collaborated with talented individuals, including Hiroaki Furuichi and Satoshi Arai. These partnerships have contributed to the successful development of his patented technologies.

Conclusion

Yoshio Oozeki's contributions to technology through his patents reflect his innovative spirit and dedication to advancing engineering solutions. His work continues to influence the fields of adhesive technology and flexible printed circuits.

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