Hitachi Media Electronics Co., Ltd.

Hitachi Plant Technologies, Ltd.

Opnext Japan, Inc.

Yoshio Oozeki

Hiroaki Furuichi

Satoshi Arai

Kazumi Takahashi

Rika Nomura

Hideo Sotokawa

Kazuhiko Ito

Mitsuo Satake

Taketoshi Moriyama

Shigeharu Tsunoda

Kazumi Kawamoto

Masayoshi Watanabe

Seiichi Tsuchida

Fumihito Ichikawa

Masayuki Okamura

Hiroyasu Yoshida

Shizuo Imaoka

Taihei Yotsuya

Katsumi Kuroguchi

A temporary part is fixed to a base by using an adhesive layer to which fillers are mixed at a predetermined density. When the temporary part is heated, heat is applied to the fillers and the adhesive layer. At a temperature equal to or higher than the glass-transition temperature of the adhesive agent, the heated adhesive layer is thermally contracted so as to release remaining stress, and on the other hand, the heated fillers are thermally expanded. In this manner, the peel-off strength between the adhesive layer and the base (or the temporary part) is reduced, and the disassembly is facilitated.

Pipe module

A connection structure of Flexible printed circuits comprising: first and second Flexible printed circuits, respectively, including a base formed of a resin, a plurality of wiring patterns arranged side by side on the base, a cover film formed of a resin to cover opposite sides of the wiring patterns to the base, and a connection portion in which the plurality of wiring patterns are not covered by the cover film, the connection portions of the first and second Flexible printed circuits being connected with each other. The wiring patterns in the connection portions include a large width portion which is larger in width than the wiring patterns covered by the cover film. The large width portions on the first Flexible printed circuit and the large width portions on the second Flexible printed circuit are connected to each other by means of soldering.

Connection structure of flexible printed circuits and optical pickup device including the connection structure

An optical pickup device includes an optical part module having a light emitting device and an optical pickup case to which the optical part module is fixed by way of an adhesive, in which the optical part module is adhesively fixed by disposing a bonding surface of the optical part module to the optical pickup case at least at two positions on lateral surfaces of the optical part module putting an optical axis therebetween, and a bonding distance L in the lateral surface between the optical part module and the optical pickup is defined as: 40 &#x3bc;m&#x3c;L&#x3c;570 &#x3bc;m, whereby the optical pickup device can maintain an optimal position at a high positional accuracy without lowering a bonding strength even when a stress due to an external load by bending moment or circumstantial changes is caused to the optical part module, particularly in the case where the optical pickup device is thin.

Optical pickup device and optical disk drive apparatus

An optical pickup device includes a holder which holds an LD and a light-receiving element and an optical pickup case on which the holder is adhesively fixed via an ultraviolet cure adhesive, and is provided with a through hole on a bonding surface of the holder in order to reduce shrinkage when ultraviolet light is irradiated and to form a blind portion on which the ultraviolet light is not irradiated from a specific direction for adhesively fixing with high position accuracy.

Optical pickup device and method of manufacture therefor

The present invention provides an optical pickup device employing a disc protector that includes a plurality of first protrusions and at least one second protrusion disposed on the lens holder, wherein the first protrusions are formed by applying a first adhesive to a plurality of areas of a top surface of the lens holder, wherein the first protrusions are arranged at different locations in the tracking direction such that the objective lens is sandwiched between the first protrusions, wherein the at least one second protrusion protrudes is formed by applying a second adhesive to at least one area of the top surface of the lens holder, and wherein tips of the first protrusions are closer to the optical disc than a tip of the at least one second protrusion.

Optical pickup device and optical disc drive apparatus

An optical pickup device having an optical module provided with an optical element and bonded and fixed to an optical pickup case, wherein the optical module is fixed to the optical pickup case by a first ultraviolet curing adhesive at at least two positions with an optical axis between the positions, the optical axis extending from the optical element to the optical pickup case, and at least a part of an exposed surface of the first ultraviolet curing adhesive is covered with a second ultraviolet curing adhesive higher in hardness or elastic modulus than the first ultraviolet curing adhesive to diminish an optical axis offset of the optical pickup device, further, a heat dissipating material higher in thermal conductivity than the first and second ultraviolet curing adhesives is brought into contact with both optical module and optical pickup case to improve the heat dissipating performance of the optical pickup device.

Optical pickup device and optical disc drive

To provide an optical pickup device in which an optical parts module is fixedly adhered in a high positional precision to an optical pickup case, such that the adhesion strength can be sufficiently enhanced against a stress to be applied to the adhering faces from a flexible printed circuit board connected to the optical parts module, the present invention forms the adhering faces on at least two portions across the optical axis of the optical parts module, and also forms groove portions on the individual surfaces of the optical parts module and the optical pickup case for the adhering faces.

Optical pickup device and manufacturing method thereof

In order to improve reliability of an optical disk drive apparatus at low cost, a flexible substrate for making connection between an optical pick-up device incorporated in the optical disk drive apparatus and a drive side is divided into a first flexible substrate fixed to the optical pick-up body (for example, upper surface), and a second flexible substrate connected to the first flexible substrate and extending to the drive, wiring conductors formed on a connection end portion of the first flexible substrate and wiring conductors formed on a connection end portion of the second flexible substrate are superposed at a region adjacent an end of the case of the optical pick-up device body, and connected to each other by joining material, and a connection section between the wiring conductors is held down by a cover for protecting the optical pick-up device body.

Optical disk drive apparatus having a flexible substrate and wiring conductors

An optical transmission module with an optical device mounted in a substrate provided with an optical waveguide is provided wherein respective metallic electrodes in pair are symmetrically disposed in each side of an optical device divided by a centerline parallel to an optical axis such that those electrodes have an error of 60 &#x3bc;m or less and said metallic electrodes are soldered to a metallic electrode as disposed on a substrate, which electrode has a size enough to cover those electrodes as disposed in the optical device.

Growing community of inventors

Yokohama, Japan

Yoshio Oozeki