Sano, Japan

Yoshio Ohya

This inventor holds 1 USPTO granted patent. Top assignee: C.i. Sanplus Co., Ltd.. Active years: 2007.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yoshio Ohya. Retrieved from https://idiyas.com/inventor/yoshio-ohya-n18ddj2p

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2007

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1 patent (USPTO):Explore Patents

Title: Innovations by Yoshio Ohya

Introduction

Yoshio Ohya is a notable inventor based in Sano, Japan. He has made significant contributions to the field of packaging technology, particularly with his innovative designs that enhance the functionality and usability of packaging materials.

Latest Patents

Yoshio Ohya holds a patent for a unique interlocking device and packaging bag. The patent, titled "Zipper and the packaging therewith," addresses the problem of providing an interlocking device that maintains heat stability against retort sterilization treatment. It also ensures that the device does not undergo deformational changes that could impair its reopenability. This innovation features a pair of male and female profiles that work together effectively.

Career Highlights

Ohya is associated with C.i. Sanplus Co., Ltd., where he continues to develop and refine his inventions. His work has been instrumental in advancing packaging solutions that meet modern consumer needs.

Collaborations

Yoshio Ohya collaborates with talented individuals such as Tatsushi Takatori and Naoki Hatakeyama, contributing to a dynamic and innovative work environment.

Conclusion

Yoshio Ohya's contributions to packaging technology through his patent demonstrate his commitment to innovation and problem-solving in the industry. His work continues to influence the way packaging is designed and utilized.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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