Company Filing History:
Years Active: 2013-2014
Title: Innovations of Yoshinori Takasaki
Introduction
Yoshinori Takasaki is a notable inventor based in Ogaki, Japan. He has made significant contributions to the field of printed wiring board technology, holding two patents that showcase his innovative approach to manufacturing.
Latest Patents
Takasaki's latest patents include a method for manufacturing a printed wiring board. This method involves forming an insulative resin layer that contains a resin and an inorganic filler. It also includes forming a conductor layer with a conductive material on the insulative resin layer. A laser beam is then irradiated upon the conductor to section it or narrow its width, ultimately forming a conductive pattern on the insulative resin layer. Notably, the inorganic filler constitutes 30 wt. % or more of the insulative resin layer. His second patent is for a wiring board that features an insulation layer containing a resin and a silica-type filler, which has a roughened surface. This wiring board includes a conductive layer with first and second conductive portions positioned adjacent to each other, with specific roughness characteristics that enhance its functionality.
Career Highlights
Yoshinori Takasaki is associated with Ibiden Company Limited, where he has been instrumental in advancing the company's technological capabilities. His work has significantly impacted the manufacturing processes within the electronics industry.
Collaborations
Takasaki has collaborated with notable coworkers, including Toru Nakai and Tetsuo Amano, contributing to a dynamic team focused on innovation and excellence in their field.
Conclusion
Yoshinori Takasaki's contributions to printed wiring board technology through his patents reflect his commitment to innovation. His work continues to influence the industry and showcases the importance of research and development in advancing technology.