Makinohara, Japan

Yoshiki Aoshima

This inventor holds 1 USPTO granted patent. Top assignee: Yazaki Corporation. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yoshiki Aoshima. Retrieved from https://idiyas.com/inventor/yoshiki-aoshima-2n2z4muq

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Yoshiki Aoshima and Electrical Wiring Connections.

Introduction

Yoshiki Aoshima is an inventor associated with Yazaki Corporation and based in Makinohara, Japan. His patent work addresses the connection of wiring materials and the electrical and safety considerations involved in joining conductors. The available information identifies 1 patent associated with him.

Latest Patents

Aoshima’s listed patent is “Connection Structure of Wiring Materials.” It describes a fastening arrangement in which a fastening member passes through aligned holes to secure a second electric conductor to a first. The structure also uses interlocking finger-touch prevention parts, while the conductors’ connection surfaces meet in the plate-thickness direction to establish an electrical connection. This design combines mechanical fastening with features intended to reduce the risk of accidental contact.

Career Highlights

Aoshima’s documented invention focuses on practical electrical connection design. Its combination of conductor fastening, electrical contact, and finger-touch prevention reflects attention to both connection reliability and user safety.

Collaborations

The patent information associates Aoshima with Yazaki Corporation. No additional collaborators are identified in the provided details.

Conclusion

Yoshiki Aoshima’s listed patent presents a wiring-material connection structure that brings together secure fastening, electrical continuity, and finger-touch prevention.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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