Tsukuba, Japan

Yoshikazu Sakal

This inventor holds 1 USPTO granted patent. Top assignee: National Research Institute for Metals. Active years: 1995.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yoshikazu Sakal. Retrieved from https://idiyas.com/inventor/yoshikazu-sakal

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 1995

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1 patent (USPTO):Explore Patents

Title: Innovations of Yoshikazu Sakal

Introduction

Yoshikazu Sakal is a prominent inventor based in Tsukuba, Japan. He is known for his significant contributions to materials science, particularly in the development of advanced copper alloys. His work has implications for various industries, including electronics and manufacturing.

Latest Patents

Sakal holds a patent for a high-strength and high-conductivity copper alloy sheet. This innovative material consists of a composition of 6 to 24 wt. % silver (Ag), with copper (Cu) and impurities as the balance. The sheet structure features Cu solid solution and Ag solid solution that are stretched into a fiber shape, enhancing its mechanical and electrical properties.

Career Highlights

Yoshikazu Sakal is affiliated with the National Research Institute for Metals, where he conducts research and development in materials science. His work has been instrumental in advancing the understanding and application of copper alloys in various fields.

Collaborations

Sakal has collaborated with notable colleagues, including Kiyoshi Inoue and Hiroshi Maeda. These partnerships have fostered innovation and contributed to the success of their research projects.

Conclusion

Yoshikazu Sakal's contributions to the field of materials science, particularly through his patented copper alloy sheet, highlight his role as a leading inventor. His work continues to influence advancements in technology and materials engineering.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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