Himeji, Japan

Yoshikazu Mitsusada

USPTO Granted Patents = 6 

 

Average Co-Inventor Count = 3.0

ph-index = 2

Forward Citations = 20(Granted Patents)


Location History:

  • Hyogo, JP (2014 - 2020)
  • Himeji, JP (2010 - 2022)

Company Filing History:


Years Active: 2010-2025

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6 patents (USPTO):Explore Patents

Title: Innovations of Yoshikazu Mitsusada

Introduction

Yoshikazu Mitsusada is a notable inventor based in Himeji, Japan. He has made significant contributions to the field of banknote handling technology. With a total of 6 patents to his name, Mitsusada has developed innovative solutions that enhance the efficiency of banknote processing.

Latest Patents

Among his latest patents is a banknote handling machine designed to function as a paper sheet bundling device. This apparatus is configured to bundle stacked banknotes with a tape. It includes bundling stackers that effectively bundle the banknotes, a tape loop forming unit that creates a small tape loop from the tape and then enlarges it into a large tape loop, and a second transport unit that grips the banknotes stacked in the bundling stackers to transport them into the large tape loop.

Career Highlights

Mitsusada has worked with prominent companies in the industry, including Glory Ltd. and Nidec Servo Corporation. His experience in these organizations has contributed to his expertise in developing advanced banknote handling technologies.

Collaborations

He has collaborated with notable coworkers such as Takeshi Kirihara and Takashi Ando, further enhancing his innovative projects.

Conclusion

Yoshikazu Mitsusada's contributions to banknote handling technology reflect his dedication to innovation and efficiency. His patents and collaborations highlight his significant role in advancing this field.

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