Sennan, Japan

Yoshikazu Hida

This inventor holds 1 USPTO granted patent. Top assignee: Daicel Chemical Industries, Ltd.. Active years: 2002.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yoshikazu Hida. Retrieved from https://idiyas.com/inventor/yoshikazu-hida-1v7gewvb

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2002

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1 patent (USPTO):Explore Patents

Title: Yoshikazu Hida and His Patent on Resinous Compositions.

Introduction

Yoshikazu Hida is an inventor associated with Sennan, Japan, and Daicel Chemical Industries, Ltd. His patent work includes a resinous composition developed as a potential substitute for vinyl chloride compounds. Hida is credited with 1 patent.

Latest Patents

Hida’s listed patent, “Resinous Composition and Sheet Product Therefrom,” describes a blend of a thermoplastic olefin resin and an acrylonitrile-styrene-alkyl acrylate copolymer. The initial blend had inferior interdispersibility compared with vinyl chloride resin combined with a plasticizer. Adding an epoxy resin improved the interdispersibility.

The patent specifies an epoxy resin selected from epoxidized diene block copolymers. These copolymers contain blocks derived from vinyl aromatic and conjugated diene monomers, with residual diene groups that have been epoxidized or partly hydrogenated. The resulting composition is presented as a potential substitute for vinyl chloride compounds and as a material for related products, including sheets.

Career Highlights

Hida’s documented patent contribution focuses on polymer formulation and improving the compatibility of resin components. The invention’s stated aim is to provide a useful alternative to vinyl chloride-based materials.

Collaborations

Shizuo Maeda and Kouichi Ishiihara are identified as Hida’s coworkers. The available information does not specify their individual roles in the patent.

Conclusion

Yoshikazu Hida’s patent describes an epoxy-modified resin blend intended to improve interdispersibility and offer an alternative to vinyl chloride compounds.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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