Aizuwakamatsu, Japan

Yoshikatsu Arayama

This inventor holds 1 USPTO granted patent. Top assignee: Mitsubishi Shindoh Co., Ltd.. Active years: 1998.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yoshikatsu Arayama. Retrieved from https://idiyas.com/inventor/yoshikatsu-arayama

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 21(Granted Patents)


Company Filing History:


Years Active: 1998

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1 patent (USPTO):Explore Patents

Title: Innovations of Yoshikatsu Arayama

Introduction

Yoshikatsu Arayama is a notable inventor based in Aizuwakamatsu, Japan. He has made significant contributions to the field of heat transfer technology. His innovative approach has led to the development of a unique heat transfer tube design.

Latest Patents

Arayama holds a patent for a "Heat transfer tube having grooved inner surface and production method." The objective of this invention is to provide a heat transfer tube with a grooved inner surface that prevents the formation of waves and cracks during tube expansion. The design features a metallic tube with a specially formed inner surface, including a weld portion and projecting strip portions, along with fins that enhance heat transfer efficiency.

Career Highlights

Yoshikatsu Arayama is associated with Mitsubishi Shindoh Co., Ltd., where he has been instrumental in advancing heat transfer technologies. His work has been recognized for its innovative design and practical applications in various industries.

Collaborations

Arayama has collaborated with notable colleagues such as Kohtaroh Nagahara and Haruo Kohno. Their combined expertise has contributed to the success of their projects and innovations.

Conclusion

Yoshikatsu Arayama's contributions to heat transfer technology exemplify the impact of innovative thinking in engineering. His patented designs continue to influence the industry and improve efficiency in heat transfer applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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