This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: C. Uyemura & Co., Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Yoshihito II and Electroless Ruthenium Plating
Introduction
Yoshihito II is an inventor associated with Osaka, Japan, and C. Uyemura & Co., Ltd. His patent work includes an electroless ruthenium plating bath, a formulation designed to deposit ruthenium without using an external electrical current. His listed portfolio includes 1 patent.
Latest Patents
“Electroless Ruthenium Plating Bath” describes a bath containing a ruthenium compound, a reducing agent, and a stabilizer. The reducing agent includes at least one amine borane compound or sodium hypophosphite. The stabilizer combines a hydroxylamine compound with an amine compound, and the hydroxylamine compound includes at least one of hydroxylamine sulfate or hydroxylamine chloride.
Career Highlights
Yoshihito II’s listed invention concerns electroless ruthenium plating chemistry. The patent identifies a combination of ruthenium compounds, reducing agents, and stabilizing components for the plating bath.
Collaborations
Yoshihito II is associated with C. Uyemura & Co., Ltd. His listed coworkers include Yoichi Maruo and Yukinori Oda.
Conclusion
Yoshihito II’s patent highlights his work on electroless ruthenium plating and the chemical formulation of a stable plating bath.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile