Company Filing History:
Years Active: 2015
Title: Innovations of Yoshihiro Todokoro in Semiconductor Technology
Introduction
Yoshihiro Todokoro is a prominent inventor based in Nara, Japan. He has made significant contributions to the field of semiconductor technology, particularly in the development of SiC (Silicon Carbide) semiconductor elements. His innovative work focuses on enhancing carrier mobility through advanced manufacturing methods.
Latest Patents
Yoshihiro Todokoro holds a patent for a SiC semiconductor element and its manufacturing method. This patent introduces a technology that simplifies the formation of a specific crystal surface, namely the {03-38} surface, which is known for its high carrier mobility in trench sidewalls. The invention details a trench structure formed in a (0001) surface or an off-oriented surface of a (0001) surface with an offset angle of 8° or lower. The channel member is integrated within this trench structure, ensuring that at least 90% of the channel member's area is a {03-38} surface or a surface offset by an angle from -8° to 8° in the <1-100> direction. The trench sidewalls are finished to {03-38} surfaces through thermal etching conducted in a chlorine atmosphere at temperatures above 800°C, using nitrogen gas as the carrier.
Career Highlights
Yoshihiro Todokoro is affiliated with the Nara Institute of Science and Technology, where he continues to advance research in semiconductor technologies. His work has garnered attention for its potential applications in various electronic devices, enhancing performance and efficiency.
Collaborations
Yoshihiro has collaborated with notable colleagues, including Tomoaki Hatayama and Hidenori Koketsu. Their joint efforts contribute to the ongoing research and development in the semiconductor field.
Conclusion
Yoshihiro Todokoro's innovative contributions to SiC semiconductor technology highlight his role as a leading inventor in the industry. His patent reflects a significant advancement in manufacturing methods that could influence future electronic applications.