The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2015

Filed:

Aug. 27, 2012
Applicants:

Tomoaki Hatayama, Nara, JP;

Hidenori Koketsu, Nara, JP;

Yoshihiro Todokoro, Nara, JP;

Inventors:

Tomoaki Hatayama, Nara, JP;

Hidenori Koketsu, Nara, JP;

Yoshihiro Todokoro, Nara, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/15 (2006.01); H01L 21/306 (2006.01); H01L 29/04 (2006.01); H01L 29/16 (2006.01); H01L 21/3065 (2006.01); H01L 29/423 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 21/04 (2006.01); H01L 29/10 (2006.01); H01L 21/308 (2006.01);
U.S. Cl.
CPC ...
H01L 21/30604 (2013.01); H01L 29/045 (2013.01); H01L 29/1608 (2013.01); H01L 21/3065 (2013.01); H01L 29/4236 (2013.01); H01L 29/4238 (2013.01); H01L 29/66068 (2013.01); H01L 29/7813 (2013.01); H01L 21/0475 (2013.01); H01L 29/1037 (2013.01); H01L 21/30617 (2013.01); H01L 21/3081 (2013.01); H01L 21/3083 (2013.01);
Abstract

Provided are a technology that simply forms a particular crystal surface such as a {03-38} surface having high carrier mobility in trench sidewalls and a SiC semiconductor element where most of the trench sidewalls appropriate for a channel member are formed from {03-38} surfaces. A trench structure formed in a (0001) surface or an off-oriented surface of a (0001) surface with an offset angle 8° or lower of SiC is provided. The channel member is in the trench structure. At least 90% of the area of the channel member is a {03-38} surface or a surface that a {03-38} surface offset by an angle from −8° to 8° in the <1-100> direction. Specifically, the trench sidewalls are finished to {03-38} surfaces by applying a thermal etching to a trench with (0001) surfaces of SiC. Thermal etching is conducted in a chlorine atmosphere above 800° C. with nitrogen gas as the carrier.


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