Yoshifusa Ogawa

Title: Innovations of Yoshifusa Ogawa

Introduction

Yoshifusa Ogawa is a notable inventor based in Amagasaki, Japan. He has made significant contributions to the field of heat transfer technology. His innovative approach has led to the development of a unique boiling heat transfer surface.

Latest Patents

Ogawa holds a patent for the "Preparation of boiling heat transfer surface." This invention provides a boiling heat transfer surface designed for efficient heat transfer between a heat source and a coolant. The surface is engineered to contact liquid coolants, such as fluorinated hydrocarbon type liquid coolants. It features metallic particles with a grain size of 60 mesh pass and 250 mesh nonpass, which are piled up and fixed by a metallic film on the heat transfer surface. This innovative design enhances the efficiency of heat transfer processes.

Career Highlights

Yoshifusa Ogawa is associated with Mitsubishi Denki Kabushiki Kaisha, a leading company in the technology sector. His work at Mitsubishi has allowed him to focus on advancements in heat transfer technologies. With a patent portfolio that includes 1 patent, Ogawa has established himself as a key figure in his field.

Collaborations

Ogawa has collaborated with notable coworkers, including Masao Fujii and Yoshiyuki Morihiro. Their combined expertise has contributed to the success of various projects within the company.

Conclusion

Yoshifusa Ogawa's contributions to heat transfer technology exemplify the spirit of innovation. His patented work continues to influence advancements in the field, showcasing the importance of research and development in engineering.