Yoshifumi Hatakeyama

Title: Innovations by Yoshifumi Hatakeyama

Introduction

Yoshifumi Hatakeyama is a notable inventor based in Sendai, Japan. He is recognized for his contributions to the field of printed wiring boards, particularly through his innovative methods that enhance manufacturability and efficiency.

Latest Patents

Hatakeyama holds a patent for a "Method of manufacturing a rigid printed wiring board." This invention provides a bending rigid printed wiring board that facilitates the mounting of electric parts, achieving high producibility and assemblability. The design allows for space-saving and easy manufacturing. The patent describes a process where a heat-resistant resin layer is laminated on both the front surface of a hard core material and the top surface of a gap portion. Additionally, a conductor layer is firmly fixed via the heat-resistant resin layers and is etched to form a circuit.

Career Highlights

Throughout his career, Hatakeyama has worked with prominent companies such as Fujikura Limited and Kyoei Electric Co., Ltd. His experience in these organizations has contributed significantly to his expertise in the field of electrical engineering and manufacturing.

Collaborations

Some of his notable coworkers include Atsushi Momota and Ichiro Terunuma. Their collaboration has likely played a role in advancing the innovations within their respective projects.

Conclusion

Yoshifumi Hatakeyama's work in the development of printed wiring boards showcases his innovative spirit and dedication to improving manufacturing processes. His contributions continue to influence the industry and inspire future advancements.