The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2012
Filed:
Jul. 28, 2006
Atsushi Momota, Tokyo, JP;
Ichiro Terunuma, Tokyo, JP;
Takeshi Hasegawa, Tokyo, JP;
Yasuo Takemura, Tokyo, JP;
Yoshifumi Hatakeyama, Sendai, JP;
Hiroshi Harada, Tokyo, JP;
Makoto Katoh, Tokyo, JP;
Atsushi Momota, Tokyo, JP;
Ichiro Terunuma, Tokyo, JP;
Takeshi Hasegawa, Tokyo, JP;
Yasuo Takemura, Tokyo, JP;
Yoshifumi Hatakeyama, Sendai, JP;
Hiroshi Harada, Tokyo, JP;
Makoto Katoh, Tokyo, JP;
Fujikura Ltd., Tokyo, JP;
Kyoei Electric Co., Ltd., Tokyo, JP;
Abstract
Provided is a bending rigid printed wiring board which facilitate the mounting of electric parts (realization of a high producibility and high assemblability substrate circuit) and enables spaces to be saved and which can be easily manufactured. That is, provided is a bending rigid printed wiring board, which is characterized in that a heat resistant resin layer is laminated on a front surface of a hard core material provided so as to contain a gap portion and also on a top surface of the gap portion, in that a heat resistant resin layer is laminated on a rear surface of the core material except the gap portion, in that a conductor layer is laminated and firmly fixed via the heat resistant resin layers and in that the conductor layer is etched, whereby a circuit is formed.