Yoriyoshi Oooka

Title: Yoriyoshi Oooka: Innovator in Copper Plating Solutions

Introduction

Yoriyoshi Oooka is a notable inventor based in Osaka, Japan. He has made significant contributions to the field of materials science, particularly in the area of copper plating solutions. His innovative approach has led to the development of a unique copper plating method that enhances the quality and adhesion of copper films.

Latest Patents

Oooka holds a patent for a copper plating solution and method for copper plating. This solution is characterized by its composition, which includes 0.03 mol/L to 0.5 mol/L of copper sulfate, 0.05 mol/L to 0.7 mol/L of ethylenediaminetetraacetic acid, and 0.02 mol/L to 0.3 mol/L of sulfite. The pH of the solution is adjusted to a range of 5.0 to 8.5. The method utilizes this copper plating solution to provide a uniform copper plating film that exhibits excellent adhesion on surfaces, such as those of rare earth metal-based permanent magnets.

Career Highlights

Yoriyoshi Oooka is associated with Hitachi Metals, Ltd., where he has been able to apply his expertise in developing advanced materials. His work has contributed to the company's reputation for innovation in the field of metal processing and plating technologies.

Collaborations

Oooka has collaborated with notable colleagues, including Fumiaki Kikui and Kaoru Kojima. These partnerships have fostered a collaborative environment that encourages the exchange of ideas and advancements in technology.

Conclusion

Yoriyoshi Oooka's contributions to copper plating technology exemplify the impact of innovative thinking in materials science. His patented solutions not only enhance the quality of copper plating but also demonstrate the importance of collaboration in driving technological advancements.