This inventor holds 1 USPTO granted patent. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2014.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2014
Title: Yoon-Hoon Kim: Innovator in Semiconductor Packaging
Introduction
Yoon-Hoon Kim is a prominent inventor based in Suwon-si, South Korea. He is known for his contributions to the field of semiconductor packaging, particularly in enhancing thermal and electric signal transmission characteristics.
Latest Patents
Yoon-Hoon Kim holds a patent for a "Package on package having improved thermal characteristics." This innovative design includes a first semiconductor package and a second semiconductor package that is larger and mounted on the first. A heat slug is adhered to the bottom of the second substrate, surrounding the first semiconductor package, which may also function as a capacitor. This invention aims to improve the overall performance of semiconductor devices.
Career Highlights
Yoon-Hoon Kim is currently employed at Samsung Electronics Co., Ltd., a leading company in the technology sector. His work focuses on developing advanced packaging solutions that meet the demands of modern electronic devices.
Collaborations
Some of his notable coworkers include Joong-Hyun Baek and Eun-Seok Cho, who contribute to the innovative projects at Samsung Electronics.
Conclusion
Yoon-Hoon Kim's work in semiconductor packaging exemplifies the importance of innovation in technology. His patent reflects a significant advancement in the field, showcasing his expertise and commitment to improving electronic device performance.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile