The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 2014
Filed:
Jun. 06, 2011
Applicants:
Yoon-hoon Kim, Suwon-si, KR;
Joong-hyun Baek, Suwon-si, KR;
Eun-seok Cho, Suwon-si, KR;
Inventors:
Assignee:
Samsung Electronics Co., Ltd., Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
Provided is a package on package (POP) having improved thermal and electric signal transmitting characteristics. The POP may include a first semiconductor package, a second semiconductor package larger than the first semiconductor package and mounted on the first semiconductor package, and a heat slug adhered to a bottom of a second substrate of the second semiconductor package and surrounding a side of the first semiconductor package. The heat slug may be a capacitor.