This inventor holds 1 USPTO granted patent. Top assignee: Huawei Technologies Co., Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Yongzhao Lin: Patent Work in Electronic Packaging
Introduction
Yongzhao Lin is an inventor associated with Dongguan, China, and Huawei Technologies Co., Ltd. His listed patent work concerns substrate design for electronic packaging, with an emphasis on compact size and high integration.
Latest Patents
Lin is associated with 1 patent: “Substrate, Packaged Structure, and Electronic Device.” The invention describes a substrate configured to connect electrically to a chip’s power and signal terminals. It uses a first substrate with a layout for the power terminal and a second substrate mounted on it, with a layout for the signal terminal. The spacing between lines in the second layout is smaller than the spacing in the first layout. The described arrangement is intended to support a compact, highly integrated substrate, packaged structure, and electronic device.
Career Highlights
Lin’s listed patent is in the field of electronic substrates and packaged devices. The patent record identifies Huawei Technologies Co., Ltd. as his company.
Collaborations
Huibin Chen is identified as Lin’s coworker. The provided information does not specify whether Chen collaborated on the patent.
Conclusion
Yongzhao Lin’s listed invention addresses electronic packaging through a two-substrate design that separates power and signal layouts while supporting compact, highly integrated devices.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile