Shanghai, China

Yongxing Lin

This inventor holds 3 USPTO granted patents and 1 published patent application. Top assignee: Covestro Deutschland Ag. Active years: 2021-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yongxing Lin. Retrieved from https://idiyas.com/inventor/yongxing-lin

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 3 

% Patents Active = 66.7

Average Co-Inventor Count = 1.4

ph-index = 1


Company Filing History:


Years Active: 2021-2025

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3 patents (USPTO):Explore Patents

Title: Yongxing Lin: Innovator in Shaped Foam Technology

Introduction

Yongxing Lin is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of materials science, particularly in the development of shaped foam technology. With a total of 3 patents to his name, Lin has established himself as a key figure in innovation.

Latest Patents

Among his latest patents, Yongxing Lin has focused on advancements in shaped foam. This innovative material has various applications across industries, showcasing Lin's commitment to enhancing product performance and functionality.

Career Highlights

Yongxing Lin is currently employed at Covestro Deutschland AG, a leading company in polymer materials. His work at Covestro has allowed him to explore new frontiers in material science, contributing to the company's reputation for innovation and quality.

Collaborations

Throughout his career, Lin has collaborated with notable colleagues, including Liqiang Li and Qingyun Wang. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Yongxing Lin's contributions to shaped foam technology and his work at Covestro Deutschland AG highlight his role as an influential inventor. His innovative spirit and collaborative efforts continue to drive advancements in the field of materials science.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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