Pyeongtaek, South Korea

Yongwon Choi

This inventor holds 1 USPTO granted patent. Top assignee: Lms Co., Ltd.. Active years: 2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yongwon Choi. Retrieved from https://idiyas.com/inventor/yongwon-choi-gxjd7m01

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: Yongwon Choi: Innovator in Adhesive Technology

Introduction

Yongwon Choi is a notable inventor based in Pyeongtaek-si, South Korea. He has made significant contributions to the field of adhesive technology, particularly with his innovative patent that addresses the needs of modern manufacturing.

Latest Patents

Yongwon Choi holds a patent for an "Adhesive sheet and transparent electrode comprising the same." This invention relates to an adhesive sheet that retains the properties of conventional adhesive sheets, such as excellent adhesion and durability in high temperature and humidity environments. The adhesive sheet can be utilized for manufacturing large-scale electrodes at low prices. The electrodes produced can be applied in various fields, including solar cells, displays, and touch panels. He has 1 patent to his name.

Career Highlights

Yongwon Choi is associated with Lms Co., Ltd., where he continues to develop innovative solutions in adhesive technology. His work has been instrumental in advancing the capabilities of adhesive materials used in electronic applications.

Collaborations

Yongwon Choi has collaborated with notable colleagues, including Hosung Na and Minsoo Lee. Their combined expertise has contributed to the successful development of innovative products in their field.

Conclusion

Yongwon Choi's contributions to adhesive technology demonstrate his commitment to innovation and excellence. His work not only enhances manufacturing processes but also opens new possibilities for various applications in technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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