Shanghai, China

Yongping Jin

This inventor holds 2 USPTO granted patents. Top assignee: Huawei Technologies Co., Limited. Active years: 2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yongping Jin. Retrieved from https://idiyas.com/inventor/yongping-jin-cg96l9ss

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 8(Granted Patents)


Company Filing History:


Years Active: 2023

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2 patents (USPTO):Explore Patents

Title: Yongping Jin: Innovator in Headphone Technology

Introduction

Yongping Jin is a notable inventor based in Shanghai, China. He has made significant contributions to the field of audio technology, particularly in the development of headphones. With a total of 2 patents to his name, Jin has established himself as a key figure in innovation.

Latest Patents

His latest patents focus on advanced headphone technology. These innovations aim to enhance user experience through improved sound quality and comfort. Jin's work in this area reflects his commitment to pushing the boundaries of audio technology.

Career Highlights

Yongping Jin is currently employed at Huawei Technologies Co., Limited, a leading global provider of information and communications technology (ICT) infrastructure and smart devices. His role at Huawei allows him to collaborate with some of the brightest minds in the industry, furthering his impact on technology.

Collaborations

Throughout his career, Jin has worked alongside talented colleagues such as Guofei Diao and Jie Huang. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Yongping Jin's contributions to headphone technology exemplify his dedication to innovation. His patents and work at Huawei Technologies Co., Limited highlight his role as a significant inventor in the audio industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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