Yongjian Lei

Title: Yongjian Lei and Radio Frequency Front-End Innovation.

Introduction

Yongjian Lei is an inventor associated with Shenzhen, China. His patent work includes a radio frequency front-end module designed to improve integration and support performance and area requirements.

Latest Patents

Lei is associated with 1 patent, titled “Radio frequency front-end module.” The application describes a design in which the second and third RF amplifier circuits are integrated into a second RF chip, while the first RF amplifier circuit is integrated into a first RF chip. Signals from the first and second amplifier circuits are routed through the first switch chip, and signals from the third amplifier circuit are routed through the second switch chip. Integrating amplifier circuits for different frequency bands into one chip can increase integration, while reducing substrate signal traces and the losses associated with excessive routing.

Career Highlights

Lei is associated with Radrock (Chongqing) Tech Co., Ltd. His patent describes an approach to organizing RF amplification and switching components to address the design demands of RF front-end modules.

Collaborations

Yuan Cao and Jie Gong are identified as Lei’s coworkers.

Conclusion

Yongjian Lei’s patent focuses on integrating RF amplifier circuits and simplifying signal routing, with the aim of balancing module performance and area requirements.