Shenzhen, China

Yonghua Fu

This inventor holds 1 USPTO granted patent. Top assignee: Nvidia Corporation. Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yonghua Fu. Retrieved from https://idiyas.com/inventor/yonghua-fu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: Yonghua Fu: Innovator in Datacenter Cooling Solutions

Introduction

Yonghua Fu is a prominent inventor based in Shenzhen, China. He is known for his innovative contributions to cooling systems for datacenter devices. With a focus on enhancing efficiency and adaptability, his work has significant implications for the technology industry.

Latest Patents

Yonghua Fu holds a patent for "Intelligent adaptable fins for cooling datacenter devices." This patent describes a cooling system that utilizes fins positioned between two plates to dissipate heat effectively. The first plate can move relative to the second plate, allowing for a change in the configuration of the fins. This adaptability exposes a greater surface area of the fins to the environment, optimizing heat dissipation.

Career Highlights

Yonghua Fu is currently employed at Nvidia Corporation, a leading company in graphics processing and AI technology. His role at Nvidia allows him to work on cutting-edge technologies that drive advancements in computing and data management.

Collaborations

Some of his notable coworkers include Shuanghu Yan and Dinghai Yi. Their collaboration contributes to the innovative environment at Nvidia, fostering the development of new technologies.

Conclusion

Yonghua Fu's work in developing intelligent cooling systems showcases his commitment to innovation in the tech industry. His patent reflects a significant advancement in datacenter technology, emphasizing the importance of efficient cooling solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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