Anhui, China

Yongbo Feng


Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2022

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1 patent (USPTO):Explore Patents

Title: Yongbo Feng: Innovator in Semiconductor Technology

Introduction

Yongbo Feng is a prominent inventor based in Anhui, China. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique semiconductor structure and its manufacturing method.

Latest Patents

Yongbo Feng holds a patent for a semiconductor structure and the method of manufacturing it. The patent outlines a comprehensive process that includes providing a substrate with distinct regions, forming polycrystalline silicon layers, and creating a stacked structure. This method enhances the efficiency and effectiveness of semiconductor manufacturing.

Career Highlights

Yongbo Feng is currently associated with Nexchip Semiconductor Co., Ltd. His role in the company has allowed him to focus on advancing semiconductor technologies. His expertise and innovative mindset have positioned him as a key player in the industry.

Collaborations

Yongbo Feng has collaborated with notable colleagues, including Hongbo Zhu and Houyou Wang. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Yongbo Feng's contributions to semiconductor technology exemplify the spirit of innovation. His patent and work at Nexchip Semiconductor Co., Ltd. highlight his commitment to advancing the field. His collaborations further enhance the impact of his inventions in the industry.

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