Shenzhen, China

Yongbao He

This inventor holds 1 USPTO granted patent. Top assignee: Cloud Intelligence Assets Holding (Singapore) Private Limited. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yongbao He. Retrieved from https://idiyas.com/inventor/yongbao-he

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Yongbao He and a Modular PCIe Expansion Design.

Introduction

Yongbao He is an inventor based in Shenzhen, China, associated with Cloud Intelligence Assets Holding (Singapore) Private Limited. His listed patent concerns modular computer expansion hardware designed to connect external devices while supporting high-speed signal transmission.

Latest Patents

He is credited with 1 patent: “Expansion Module, PCIe Expansion Module, Chassis Assembly, Computer, and Server Cluster.” The invention describes a detachable bracket carrying a circuit board that connects to a computer by cable and provides a port for an external device. The port passes through an opening in an end plate so it remains accessible when the module is installed. By potentially eliminating a separate interface board, the design aims to improve high-speed signal transmission quality.

Career Highlights

The available information highlights He’s work on computer and server expansion systems. His patent addresses the mechanical mounting and electrical connection of an expansion module, with applications spanning computers, chassis assemblies, and server clusters.

Collaborations

Chunjia Sun is identified as He’s coworker. The available details do not specify Sun’s role in the patent or the nature of their collaboration.

Conclusion

Yongbao He’s listed patent presents a detachable PCIe expansion approach that combines accessible external connectivity with a design intended to support high-speed signal quality.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…