Hsinchu, Taiwan

Yong-Zhen Chung

This inventor holds 1 USPTO granted patent. Top assignee: Industrial Technology Research Institute. Active years: 2003.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yong-Zhen Chung. Retrieved from https://idiyas.com/inventor/yong-zhen-chung

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2003

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1 patent (USPTO):Explore Patents

Title: Yong-Zhen Chung and Electromagnetic Mold-Clamping Innovation.

Introduction

Yong-Zhen Chung is an inventor associated with Hsinchu, Taiwan, and the Industrial Technology Research Institute. His work includes an electromagnetic mold-clamping invention designed to support mold opening, closing, and locking.

Latest Patents

Chung is credited with 1 patent: “Linkage Type Mold Clamping Device Driven by Electromagnetic Force.” The patent describes a mold-clamping system with a stationary plate, a movable plate that slides along a guiding mechanism, and a driving mechanism. Electromagnetic force moves the linkage and movable plate to perform mold-opening, mold-closing, and mold-locking operations.

Career Highlights

Chung’s patent connects electromagnetic actuation with the mechanical functions of a mold-clamping system. The disclosed design uses magnetic force to drive the linkage and movable components.

Collaborations

Chung’s listed coworkers include Hsin-Hung Lin and Hsuan Peng. His association with the Industrial Technology Research Institute places the invention within an institutional research and development setting.

Conclusion

Yong-Zhen Chung’s patent documents an electromagnetic approach to mold clamping, combining magnetic actuation with guided movement for opening, closing, and locking a mold.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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