Singapore, Singapore

Yong Wee Liu

This inventor holds 1 USPTO granted patent. Top assignee: St Engineering Aerospace Ltd.. Active years: 2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yong Wee Liu. Retrieved from https://idiyas.com/inventor/yong-wee-liu-sbpqh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2022

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1 patent (USPTO):Explore Patents

Title: Yong Wee Liu - Innovator in Grinding Technology

Introduction

Yong Wee Liu is a notable inventor based in Singapore, recognized for his contributions to grinding technology. He has developed innovative solutions that enhance the efficiency and effectiveness of grinding processes. His work is particularly significant in the field of manufacturing and engineering.

Latest Patents

Yong Wee Liu holds a patent for a grinding module, a grinding machine, and a method for grinding. This invention includes a base and a cylinder mounted to the base, with the cylinder being rotatable about its longitudinal axis. The cylindrical surface of the cylinder is designed to receive a grinding belt, allowing for precise grinding and shaping of workpieces. The linear actuator integrated into the design enables movement of the holder, which holds the workpiece, ensuring that the grinding process conforms to a curved profile.

Career Highlights

Yong Wee Liu is associated with ST Engineering Aerospace Ltd., where he applies his expertise in engineering and innovation. His role at the company allows him to contribute to advancements in aerospace technology, particularly in the area of grinding machinery.

Collaborations

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Conclusion

Yong Wee Liu's innovative work in grinding technology exemplifies the impact of engineering advancements on manufacturing processes. His patent and contributions to ST Engineering Aerospace Ltd. highlight his role as a key figure in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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