Singapore, Singapore

Yong Sheng Wang

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Heraeus Materials Singapore Pte. Ltd.. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yong Sheng Wang. Retrieved from https://idiyas.com/inventor/yong-sheng-wang-owvhtmgo

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0


Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Innovations of Inventor Yong Sheng Wang in Coated Round Wire Technology

Introduction

Yong Sheng Wang, a notable inventor based in Singapore, has made a significant mark in the field of materials science with his innovative approach to coated round wire technology. He holds one patent that showcases his expertise in combining metals for enhanced performance and durability in various applications.

Latest Patents

Wang's patent is titled "Coated Round Wire," which represents a sophisticated design that incorporates a silver-based wire core with a meticulously crafted coating layer. This coating is a double-layer comprising an inner layer made of palladium or nickel with a thickness ranging from 1 to 100 nm and an outer layer of gold, ranging from 1 to 250 nm thick. Remarkably, the outer gold layer is engineered to exhibit specific intrinsic properties, such as a controlled average grain size and particular orientations of the crystal grains, thus optimizing the wire's performance for its intended applications.

Career Highlights

Currently, Yong Sheng Wang is employed at Heraeus Materials Singapore Pte. Ltd., a company renowned for its innovation in material solutions. His work contributes to advancing technologies in the field, demonstrating his commitment to research and development in high-quality wire applications.

Collaborations

Wang collaborates with a talented team at Heraeus, including coworkers Miew Wan Lo and Murali Sarangapani. Together, they foster an environment of creativity and technological advancement, pushing the boundaries of what is possible in material engineering.

Conclusion

Yong Sheng Wang’s contributions through his patent on coated round wire illustrate his role as an innovative inventor. His work not only reflects his individual capabilities but also signifies the collaborative spirit of his team at Heraeus Materials Singapore Pte. Ltd. As he continues to develop and refine materials technology, the impact of his inventions will undoubtedly echo across the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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