Company Filing History:
Years Active: 2013-2016
Title: Yong-Liang Chen: Innovator in Semiconductor Packaging
Introduction
Yong-Liang Chen is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 3 patents. His innovative methods have enhanced the efficiency and reliability of semiconductor devices.
Latest Patents
One of his latest patents is titled "Method of fabricating a semiconductor package with heat dissipating structure having a deformed supporting portion." This patent describes a method that includes providing a heat dissipating structure with a deformable supporting portion. The process involves coupling a carrier with a semiconductor element to the heat dissipating structure, creating a receiving space for the semiconductor element. This design improves the bonding between the heat dissipating structure and the mold used for packaging, preventing overflow of encapsulant onto the external surface.
Another notable patent is the "Method of fabricating semiconductor package." This patent outlines a semiconductor package that includes an insulating layer, traces, connection pads, and a semiconductor chip. The encapsulant formed on the insulating layer encapsulates the semiconductor chip and prevents voids from forming in the traces and connection pads, significantly increasing the yield of the process.
Career Highlights
Yong-Liang Chen is currently employed at Siliconware Precision Industries Co., Ltd. His work at this leading semiconductor packaging company has allowed him to develop and refine his innovative techniques. His contributions have been instrumental in advancing the technology used in semiconductor manufacturing.
Collaborations
Yong-Liang has collaborated with notable coworkers such as Yueh-Ying Tsai and Pang-Chun Lin. Their teamwork has fostered an environment of innovation and has led to the successful development of new semiconductor packaging methods.
Conclusion
Yong-Liang Chen's work in semiconductor packaging exemplifies the spirit of innovation. His patents reflect a commitment to improving technology in the semiconductor industry. His contributions will continue to influence the field for years to come.