Yong Kee Yeo

Title: Yong Kee Yeo: Innovator in Optical and Chip Scale Packaging Technologies

Introduction

Yong Kee Yeo is a prominent inventor based in Singapore, known for his contributions to the fields of optical devices and chip scale packaging. With a total of 4 patents to his name, Yeo has made significant advancements that enhance the performance and reliability of electronic components.

Latest Patents

Yeo's latest patents include an "Enhanced chip scale package for wire bond dies" and an "Optical device carrier." The enhanced chip scale package assembly features an integrated circuit die wire bonded to a carrier, which is designed for mounting to a printed circuit board. This innovative design includes top and bottom ground planes that are thermally and electrically bonded, improving signal integrity and heat management. The optical device carrier patent describes a layout that integrates a pair of terminals, a resistor, and an optical device, forming an efficient optical signal transmission system. This design allows for optimal placement and connection of components, enhancing the overall functionality of optical devices.

Career Highlights

Throughout his career, Yong Kee Yeo has worked with various organizations, including the Institute of Microelectronics. His work has focused on developing technologies that push the boundaries of electronic and optical systems, making him a valuable asset in the field of innovation.

Collaborations

Yeo has collaborated with notable professionals such as Mahadevan Krishna Iyer and Damaruganath Pinjala. These collaborations have contributed to the advancement of his projects and the successful development of his patented technologies.

Conclusion

Yong Kee Yeo's innovative work in chip scale packaging and optical devices showcases his expertise and commitment to advancing technology. His contributions continue to influence the industry and pave the way for future innovations.