Suwon, South Korea

Yong Hae Hwang

This inventor holds 1 USPTO granted patent. Top assignee: University-Industry Cooperation Group of Kyung Hee University. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yong Hae Hwang. Retrieved from https://idiyas.com/inventor/yong-hae-hwang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Yong Hae Hwang: Innovator in Point Cloud Interpolation

Introduction

Yong Hae Hwang is a notable inventor based in Suwon-si, South Korea. He has made significant contributions to the field of technology, particularly in the area of point cloud interpolation. His work is characterized by innovative approaches that enhance the efficiency and accuracy of data processing.

Latest Patents

Hwang holds a patent for an "Apparatus for Interpolating Point Cloud and Method Thereof." This invention discloses a technology for interpolating a point cloud based on V-PCC decoding information and a 2D interpolation technology. This advancement is crucial for applications that require precise data representation and manipulation.

Career Highlights

Yong Hae Hwang is affiliated with the University-Industry Cooperation Group of Kyung Hee University. His role in this group allows him to bridge the gap between academic research and practical applications, fostering innovation in technology.

Collaborations

Hwang has collaborated with notable colleagues, including Jun Sik Kim and Kyu Heon Kim. These partnerships enhance the research and development efforts within their field, contributing to the advancement of technology.

Conclusion

Yong Hae Hwang is a distinguished inventor whose work in point cloud interpolation exemplifies the intersection of academic research and practical application. His contributions continue to influence the technological landscape.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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