Company Filing History:
Years Active: 2010-2012
Title: Yong-Chao Qiao: Innovator in Chip Packaging Technology
Introduction
Yong-Chao Qiao is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of chip packaging technology, holding a total of 4 patents. His innovative methods have advanced the efficiency and effectiveness of chip fabrication processes.
Latest Patents
Yong-Chao Qiao's latest patents include a "Method of Fabricating Chip Package Structure" and a "Method of Fabricating Chip Package." The first patent outlines a process that involves providing a lead frame with a die pad and multiple leads, followed by the placement of a chip on the die pad. The method includes forming bonding wires to connect the chip to the leads and encapsulating the assembly with upper and lower encapsulants. The first lower encapsulant features concaves that expose a structure enhancement element, which is then etched to ensure electrical insulation. The second patent describes a similar process using a thin metal plate with protrusions, where a chip is connected through bonding wires, and the assembly is encapsulated and etched for optimal performance.
Career Highlights
Yong-Chao Qiao is currently employed at Chipmos Technologies (Bermuda) Ltd. His work at this company has allowed him to focus on developing advanced chip packaging solutions that meet the demands of modern electronics. His expertise in this area has positioned him as a key player in the industry.
Collaborations
Yong-Chao has collaborated with notable coworkers such as Yan-Yi Wu and Jie-Hung Chiou. Their combined efforts have contributed to the successful development of innovative technologies in chip packaging.
Conclusion
Yong-Chao Qiao's contributions to chip packaging technology through his patents and work at Chipmos Technologies highlight his role as a leading inventor in the field. His innovative methods continue to shape the future of electronics manufacturing.