Madison, WI, United States of America

Yolanda M Reifein

This inventor holds 2 USPTO granted patents. Top assignee: Oscar Mayer Foods Corporation. Active years: 1989.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yolanda M Reifein. Retrieved from https://idiyas.com/inventor/yolanda-m-reifein

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 2

Forward Citations = 99(Granted Patents)


Company Filing History:


Years Active: 1989

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2 patents (USPTO):Explore Patents

Title: Yolanda M. Reifein: Innovator in Packaging Solutions

Introduction

Yolanda M. Reifein is a notable inventor based in Madison, WI (US). She has made significant contributions to the field of packaging, holding 2 patents to her name. Her work has been instrumental in advancing packaging technologies, particularly in the food industry.

Latest Patents

Yolanda's latest patents focus on innovative packaging solutions that enhance product preservation and consumer convenience. These patents reflect her commitment to improving the functionality and sustainability of packaging materials.

Career Highlights

Yolanda is currently employed at Oscar Mayer Foods Corporation, where she applies her expertise in packaging design and development. Her role at the company allows her to work on projects that directly impact the food industry, ensuring that products are delivered to consumers in optimal condition.

Collaborations

Yolanda has collaborated with various professionals in her field, including her coworker Paul E. Grindrod. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Yolanda M. Reifein is a pioneering inventor whose work in packaging has made a lasting impact on the industry. Her contributions continue to shape the future of packaging solutions, demonstrating her dedication to innovation and excellence.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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